We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

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Free Sample
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

Less Energy

More Efficiency

  • Home
  • Products 
    • IPM Modules
    • IGBT Modules
    • IGBT Discretes
    • IGBT Chips
    • SiC
    • FRD(MUR)
    • Bridge Rectifier
  • Application 
    • Energy Vehicle
    • Home Appliance
    • Renewable Energy
    • Industrial Equipment
    • Data Centers
  • Technology 
    • Latest IPM Technology
    • High Voltage (HV) Die Technolog
    • Reliability & Qualification
  • About Us 
    • Our Company
    • Technical Team
    • Custom Solutions
  • Contact Us
  • Blog
  • …  
    • Home
    • Products 
      • IPM Modules
      • IGBT Modules
      • IGBT Discretes
      • IGBT Chips
      • SiC
      • FRD(MUR)
      • Bridge Rectifier
    • Application 
      • Energy Vehicle
      • Home Appliance
      • Renewable Energy
      • Industrial Equipment
      • Data Centers
    • Technology 
      • Latest IPM Technology
      • High Voltage (HV) Die Technolog
      • Reliability & Qualification
    • About Us 
      • Our Company
      • Technical Team
      • Custom Solutions
    • Contact Us
    • Blog
Free Sample
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

SHYSEMI DIP24 Intelligent Power Module (IPM) - High-Efficiency BLDC Driver

Product Overview

The SHYSEMI DIP24 Intelligent Power Module (IPM) is a highly integrated, high-reliability 3-phase brushless DC (BLDC) motor driver circuit. Engineered for efficiency and durability, this module is the ideal solution for low-power variable frequency drive (VFD) applications.

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Key Features & Technical Advantages

  • Advanced Thermal Management: Utilizes a Direct Bonded Copper (DBC) substrate for power devices, providing superior electrical insulation and high thermal conductivity for efficient heat dissipation.
  • Robust Architecture: Features a high-reliability copper lead frame to support the driver IC, ensuring stable electrical connections and structural integrity.
  • Precision Temperature Monitoring: Includes an optional integrated thermistor (NTC) pin on the power side, allowing for real-time, high-precision module temperature sensing and thermal protection.
  • Ultra-Compact Design: The space-saving DIP24 footprint is designed for easy integration, making it perfect for applications with stringent mechanical constraints and compact mounting requirements.

POD dimension drawing

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Internal circuit diagram

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Applications

This IPM is specifically optimized for high-efficiency motor control in consumer electronics and industrial systems, including:

  • HVAC Systems: Air conditioner compressors and fan motors
  • Home Appliances: High-performance refrigerators and washing machine drum drives
  • Industrial Automation: Low-power frequency converters and small-scale pump drives.

Technical Specifications Summary

Why Choose SHYSEMI IPM?

Our modules bridge the gap between high power density and thermal reliability. By using DBC technology, we ensure that your inverter designs remain cool and compact, even under continuous heavy loads, Contact us!

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