• IPM

    DIP-24 Package

    As one of SHYSEMI's classic and mature package platforms, DIP-24 benefits from 10+ years of proven manufacturing and soldering process reliability, ensuring high production yield and minimal operational risk. Compared with ultra-dense packages, DIP-24 offers lower parasitic capacitance and inductance between pins, which enhances signal stability in noise-sensitive analog or mid-to-low frequency digital circuits.

    SYIM10G60BTB

    • Package：DIP-24H
    • Voltage(V): 600
    • Current(A): 10
    • RDS(on)@Typ.Tj=25°C: 1.8

    SYIM15G60BTB

    • Package：DIP-24H
    • Voltage(V): 600
    • Current(A): 15
    • RDS(on)@Typ.Tj=25°C: 1.7

    SYIM20G60BTB

    • Package：DIP-24H
    • Voltage(V): 600
    • Current(A): 20
    • RDS(on)@Typ.Tj=25°C: 1.7

    SYIM30G60BTB

    • Package：DIP-24H
    • Voltage(V): 600
    • Current(A): 30
    • RDS(on)@Typ.Tj=25°C: 1.7

    SYIM15D60

    • Package：DIP-24H
    • Voltage(V): 600
    • Current(A): 15
    • RDS(on)@Typ.Tj=25°C: 1.6

  • Applications:

    The DIP-24 package features robust through-hole leads and a solid encapsulated body, capable of withstanding substantial mechanical stress and vibration. The interconnections are extremely secure.The inherent strengths of the DIP-24 package make it widely adopted in the following areas:

    • Air conditioning compressor
    • Refrigerator compressor
    • Low power invert
    • Air cleaner
    • Frequency converter

  • Features:

    • Integrated 6 low-loss IGBTs
    • Integrated high voltage gate drive circuit (HVIC)
    • Built-in under voltage protection and over temperature, over current protection and temperature output
    • Built-in fast recovery bootstrap diode with current limiting resistor
    • Insulation class 1500 Vrms / min
    • High reliability and thermal stability,good parameter consistency
    • Built-in temperature output
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