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WhatsApp: +86 153 6155 4542
info@shysemi.com
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

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    • Home
    • Products 
      • IPM
      • IGBT Modules
      • IGBT Discretes
      • IGBT Chips
      • SiC
      • FRD(MUR)
      • Bridge Rectifier
    • Application 
      • New Energy Vehicle
      • Home Appliance
      • Energy Storage
      • Industrial Equipment
      • Data Centers
    • Technology
    • Our Teams
    • Blog
    • Contact Us
Sample Request
WhatsApp: +86 153 6155 4542
info@shysemi.com
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

Less Energy

More Efficiency

  • Home
  • Products 
    • IPM
    • IGBT Modules
    • IGBT Discretes
    • IGBT Chips
    • SiC
    • FRD(MUR)
    • Bridge Rectifier
  • Application 
    • New Energy Vehicle
    • Home Appliance
    • Energy Storage
    • Industrial Equipment
    • Data Centers
  • Technology
  • Our Teams
  • Blog
  • Contact Us
  • …  
    • Home
    • Products 
      • IPM
      • IGBT Modules
      • IGBT Discretes
      • IGBT Chips
      • SiC
      • FRD(MUR)
      • Bridge Rectifier
    • Application 
      • New Energy Vehicle
      • Home Appliance
      • Energy Storage
      • Industrial Equipment
      • Data Centers
    • Technology
    • Our Teams
    • Blog
    • Contact Us
Sample Request
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
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Capable of withstanding harsh environments

Capable of withstanding harsh environments

The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use.
The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints.
This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions.
  • Chip Designer and Manufacturer

    SHYSEMI design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

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    SHYSEMI puts people at the heart of its culture, focusing on each employee’s growth and well-being. We provide clear career paths, ongoing learning opportunities, and regular team events.

SHYSEMI is striving to become a world-leading semiconductor supplier.

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