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Capable of withstanding harsh environments
The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use.
The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints.
This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions.
The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints.
This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions.


