Factory Area
9000+m²
Production Line
30 production lines
Production Capacity
2.1KK / M
Key Processes & Equipment
SHYSEMI operates an integrated IPM manufacturing and assembly line, covering wafer dicing, substrate processing, SMT, DBC assembly, vacuum reflow soldering, wire bonding, molding, electroplating, laser marking, and final testing.
Core Manufacturing Equipment
- ASM Die Bonder: ±1.0 mil XY accuracy, supporting chips as thin as 60 μm.
- German SMT Vacuum Reflow Oven: Up to 350°C soldering temperature with a solder void rate below 1%.
- K&S & ASM Wire Bonders: High-precision aluminum and gold wire bonding for stable bonding performance.
Team-Building & Corporate Culture
SHYSEMI is built on a human-centric corporate culture. By organizing team-building trips, social events, and professional workshops, we foster a dynamic workplace where we grow together. We are deeply committed to transforming our employees into genuine business partners.
Need datasheets, pricing, or custom power services? Visit shysemi.com
We'll quickly match the most suitable products for you based on your requirements.
SHYSEMI offers custom solutions for Chips, IPMs, SiC, and IGBTs.
Our IPM products perform exceptionally well in the industrial control and variable frequency fields.
We are ready to address your exact requirements.
