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WhatsApp: +86 153 6155 4542
info@shysemi.com
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

Less Energy

More Efficiency

  • Home
  • Products 
    • IPM
    • IGBT Modules
    • IGBT Discretes
    • IGBT Chips
    • SiC
    • FRD(MUR)
    • Bridge Rectifier
  • Application 
    • New Energy Vehicle
    • Home Appliance
    • Energy Storage
    • Industrial Equipment
    • Data Centers
  • Technology
  • Our Teams
  • Blog
  • Contact Us
  • …  
    • Home
    • Products 
      • IPM
      • IGBT Modules
      • IGBT Discretes
      • IGBT Chips
      • SiC
      • FRD(MUR)
      • Bridge Rectifier
    • Application 
      • New Energy Vehicle
      • Home Appliance
      • Energy Storage
      • Industrial Equipment
      • Data Centers
    • Technology
    • Our Teams
    • Blog
    • Contact Us
Sample Request
WhatsApp: +86 153 6155 4542
info@shysemi.com
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

Less Energy

More Efficiency

  • Home
  • Products 
    • IPM
    • IGBT Modules
    • IGBT Discretes
    • IGBT Chips
    • SiC
    • FRD(MUR)
    • Bridge Rectifier
  • Application 
    • New Energy Vehicle
    • Home Appliance
    • Energy Storage
    • Industrial Equipment
    • Data Centers
  • Technology
  • Our Teams
  • Blog
  • Contact Us
  • …  
    • Home
    • Products 
      • IPM
      • IGBT Modules
      • IGBT Discretes
      • IGBT Chips
      • SiC
      • FRD(MUR)
      • Bridge Rectifier
    • Application 
      • New Energy Vehicle
      • Home Appliance
      • Energy Storage
      • Industrial Equipment
      • Data Centers
    • Technology
    • Our Teams
    • Blog
    • Contact Us
Sample Request
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
  • Bridge Rectifier

    Why choose SHYSEMI's Bridge Rectifier?

    SHYSEMI's Bridge Rectifier packages are constructed with a 94V-0 rated flame-retardant material, indicating the highest level of flame resistance in vertical burn tests. Their heat resistance specification reaches 260°C / 5 seconds, fully complying with the stringent industrial standard JIS C 60068-2-20 (Japan). Additionally, they carry a specified rating for fusing (t<8.3ms), which represents a standardized industrial pulse test used to simulate the most severe single-cycle fault current conditions.

  • Package List

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    GBPC

    A bridge rectifier plays a vital role in power circuits. It converts AC - DC, providing reliable power for electronic devices.This product features a through-hole package with pins and fixed mounting holes for stable installation.

    Details
    Section image

    GBJ

    A bridge rectifier, also known as a diode bridge, is a discrete semiconductor module that converts alternating current to direct current (AC-DC) using four diodes in a bridge circuit. Valued for its simplicity, low cost, and high reliability, it remains an irreplaceable solution for low-to-medium power rectification at industrial frequencies. For high-frequency, high-current applications demanding peak efficiency, synchronous rectification has become the mainstream alternative.

    Details
  • GBPC Mechanical Data

    The exposed metal backplate of the GBPC package is the key to its functionality. It allows the use of screws to apply significant pressure and secure it to the heat sink, achieving an ultra-low thermal resistance. As an independent external power component, it can be installed on either an independent heat sink or on the metal casing of the computer case (with insulation), and is installed very firmly. Moreover, it is very convenient for inspection and replacement during maintenance.

    • Case:Reliable low cost construction utilizingmolded plastic technique
    • Terminals: Plated leads solderable per MlL-STD-202Method 208
    • Mounting Position: Any

    GBPC35005 thru GBPC3510

    • Package: GBPC
    • VRRM: 50-1000
    • IF (AV): 400
    • VF: 1.1
    Specification
  • Features:

    • ldeal for printed circuit board mounting
    • This series is UL listed under the Recognized Component Index,file number E484648
    • The plastic material used carries Underwriters Laboratoryflammability recognition 94V-0
    • Built-in printed circuit board stand-offs
    • High case dielectric strength
    • High temperature soldering guaranteed 260℃/5 seconds at 5 lbs (2.3kg) tension
    Section image
  • GBJ Mechanical Data

    GBJ is an extremely classic rectifier bridge package. Its cubic shape and single-sided mounting feature result in a very small projected area and height space on the PCB, making it highly suitable for compact designs.

    • Case:Reliable low cost construction utilizingmolded plastic technique
    • Terminals: Plated leads solderable per MlL-STD-202Method 208
    • Mounting Position: Any

    GBJ50005 thru GBJ5010

    • Package: GBJ
    • VRRM: 50-1000
    • IF (AV): 50
    • VF: 1.1
    Specification

    GBJ2002 thru GBJ2010

    • Package: GBJ
    • VRRM: 200-1000
    • IF (AV): 20
    • VF: 1.1
    Specification

    GBJ35005 thru GBJ3510

    • Package: GBJ
    • VRRM: 50-1000
    • IF (AV): 35
    • VF: 1.1
    Specification
  • Features:

    • ldeal for printed circuit board mounting
    • This series is UL listed under the Recognized Component Index,file number E484648
    • The plastic material used carries Underwriters Laboratoryflammability recognition 94V-0
    • Built-in printed circuit board stand-offs
    • High case dielectric strength
    • High temperature soldering guaranteed 260℃/5 seconds at 5 lbs (2.3kg) tension
    Section image

SHYSEMI is striving to become a world-leading semiconductor supplier.

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