Go Back
High-power, high-density, and high-reliability applications.
The SIP-35 package is specifically engineered for high-power, high-density, and high-reliability applications.
SHYSEMI has optimized its internal structure to achieve ultra-low parasitic inductance and on-resistance (R<sub>DS(on)</sub>), which are critical for high-frequency switching applications such as switch-mode power supplies (SMPS) and inverters.
These optimizations significantly reduce switching losses and voltage overshoot, enhancing overall system efficiency and reliability.
The SIP-35 package typically features a single-screw mounting design, enabling easy installation and uniform pressure distribution. This ensures excellent thermal contact between the package and the heatsink, improving heat dissipation and long-term operational stability.
SHYSEMI has optimized its internal structure to achieve ultra-low parasitic inductance and on-resistance (R<sub>DS(on)</sub>), which are critical for high-frequency switching applications such as switch-mode power supplies (SMPS) and inverters.
These optimizations significantly reduce switching losses and voltage overshoot, enhancing overall system efficiency and reliability.
The SIP-35 package typically features a single-screw mounting design, enabling easy installation and uniform pressure distribution. This ensures excellent thermal contact between the package and the heatsink, improving heat dissipation and long-term operational stability.