The SOP-23 (Small Outline Package) is a surface-mount package, with leads extending from the sides rather than passing through the PCB.
This design yields a much smaller footprint than any DIP package, enabling significant PCB space savings and supporting miniaturization and lightweight design in modern electronics. It allows complex circuitry to be integrated into a smaller board area.
Despite its compact size, the SOP-23 package typically employs thermally conductive encapsulation materials, and its exposed thermal pad can be directly soldered to the PCB copper layer for efficient heat dissipation.