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Withstand severe vibration, impact, thermal cycling
The SDIP-26 package achieves an exceptional balance among pin count, mechanical strength, thermal performance, and compactness.
Its sturdy through-hole leads are soldered directly through the PCB, forming an extremely reliable mechanical and electrical connection.
This robust construction enables the SDIP-26 to withstand severe vibration, impact, and thermal cycling, which is why it continues to be widely adopted in industrial, automotive, and aerospace applications. Its reliability far exceeds that of most surface-mount packages.
Additionally, SDIP-26 pins can be easily inserted into standard IC sockets, making it highly convenient during R&D, prototyping, and maintenance phases. This feature simplifies testing and replacement procedures, reducing both development complexity and long-term service costs.
Its sturdy through-hole leads are soldered directly through the PCB, forming an extremely reliable mechanical and electrical connection.
This robust construction enables the SDIP-26 to withstand severe vibration, impact, and thermal cycling, which is why it continues to be widely adopted in industrial, automotive, and aerospace applications. Its reliability far exceeds that of most surface-mount packages.
Additionally, SDIP-26 pins can be easily inserted into standard IC sockets, making it highly convenient during R&D, prototyping, and maintenance phases. This feature simplifies testing and replacement procedures, reducing both development complexity and long-term service costs.