SHYsemi sincerely invites you to attend: SEMI-e Shenzhen International Semiconductor Exhibition and 2025 Integrated Circuit Industry Innovation Exhibition
As a highly influential and professional semiconductor exhibition, this event covers an exhibition area of 60,000 square meters and brings together over 1,000 exhibitors.
It covers the entire industrial chain ecosystem from EDA tools, semiconductor materials, equipment manufacturing to chip design, packaging and testing applications.
It sets up six major theme exhibition areas including chip design and application, IC manufacturing, wafer equipment, packaging equipment, core components and materials, compound semiconductors and power devices.
It creates a professional exhibition platform integrating business negotiations, international exchanges and brand display for the semiconductor manufacturing, integrated circuits, electronic power, electronic manufacturing, display manufacturing, as well as automotive, information communication, and consumer electronics sectors, helping to expand global business opportunities.
Exhibition Scope:
IC Design / Chips and Applications
Automotive Chips Exhibition Area: Comprehensive display of the latest achievements and applications in the automotive chip field, setting up a "Automotive Chip Ecosystem" exhibition area to showcase the close cooperation and coordinated development among chip manufacturers, automotive manufacturers,and component suppliers along the industrial chain.
Smart Home Appliances Chips Exhibition Area： Focusing on the transformation of home appliances towards intelligence,concentrating on showcasing core technologies such as low-power MCUs,wireless connection chips,AI voice recognition chips,etc.,while demonstrating breakthrough technologies in energy efficiency optimization and standby power consumption control for home appliance chips.
Artificial Intelligence Chips Exhibition Area： Focusing on intelligent chips,sensors,algorithm architectures,development tools,etc. Displaying breakthrough progress in quantum computing,large model training,edge computing,etc.
Design and Application Exhibition Area： IoT,artificial intelligence,automotive electronics,smart cities,smart terminals,health care,industrial applications,through physical displays,case sharing,etc.,showcasing how integrated circuit technology can empower various industries.
Wafer Equipment
Semiconductor wafer processing equipment and other related equipment,focusing on various precision equipment required during the wafer processing process.
AI Computing Power
AI chips,servers,switches,power supplies,liquid cooling temperature control,etc.；
IC Manufacturing
Semiconductor manufacturing processes,semiconductor packaging processes and testing technologies,while introducing new manufacturing models such as green manufacturing and intelligent manufacturing.
Packaging and Testing Equipment
Semiconductor packaging equipment,semiconductor testing equipment,IC testing instruments,including advanced packaging processes (such as SiP,3D packaging) equipment,etc.
Core Components and Materials
Focusing on key raw materials,components and auxiliary materials in integrated circuit manufacturing,such as single crystal silicon,silicon wafers,etc.
Compound Semiconductors and Power Devices
Emphasizing the display of compound semiconductor materials (such as GaN,SiC) and related products,including power devices,RF devices and related upstream equipment and materials,etc.
Exhibition Dates：
September 10th - 12th
Exhibition Location：
Shenzhen International Convention and Exhibition Center