The SIP-35 package typically features a single-screw mounting design, enabling easy installation and uniform pressure distribution. This ensures excellent thermal contact between the package and the heatsink, improving heat dissipation and long-term operational stability. By combining IGBT devices, gate drivers and protection circuits in one package, the module improves system reliability, reduces PCB complexity and shortens product development cycles for industrial power electronics designs. The SIP-35 package delivers an optimized solution for applications demanding maximum efficiency, power density, and reliability.
