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- Products
- IPM Modules
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- Energy Vehicle
- Home Appliance
- Renewable Energy
- Industrial Equipment
- Data Centers
Less Energy
More Efficiency
- Products
- IPM Modules
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- Energy Vehicle
- Home Appliance
- Renewable Energy
- Industrial Equipment
- Data Centers
- …
- Products
- IPM Modules
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- Energy Vehicle
- Home Appliance
- Renewable Energy
- Industrial Equipment
- Data Centers
IPM-SIP-35 Package
600V Intelligent Power Module (IPM) with integrated IGBT and protection, designed for converter, air cond and power electronics systems.
What optimizations has SHYSEMI made to SIP-35?
The SIP-35 package is specifically engineered for high-power, high-density, and high-reliability applications.
SHYSEMI has optimized its internal structure to achieve ultra-low parasitic inductance and on-resistance (RDS(on)), which are critical for high-frequency switching applications such as switch-mode power supplies (SMPS) and inverters.These optimizations significantly reduce switching losses and voltage overshoot, enhancing overall system efficiency and reliability.Select model
[SYIM756C-SAAT] 600V/15A Compact SIP intelligent power module with SiC PFC, optimized thermal design
[SYIM756C-SST] 600V/15A, Hybrid SiC IPM with integrated PFC, low power loss, and built-in protection
[SYIM756C-SFT] 600V/15A, Hybrid SiC Intelligent Power Module integrating 3-phase inverter and PFCApplications:
The SIP-35 package typically features a single-screw mounting design, enabling easy installation and uniform pressure distribution. This ensures excellent thermal contact between the package and the heatsink, improving heat dissipation and long-term operational stability. By combining IGBT devices, gate drivers and protection circuits in one package, the module improves system reliability, reduces PCB complexity and shortens product development cycles for industrial power electronics designs. The SIP-35 package delivers an optimized solution for applications demanding maximum efficiency, power density, and reliability.
- Inverter
- Converter
Features:
- Fully Insulated Single In-line Power Module
- Using IMS Insulated and Heat-dissipating Substrate
- SIP (single in line) Fully Insulated Package Structure is Adopted
- Three-phase full bridge 20A 600V, PFC 40A 600V
- Active High, Compatible With TTL / CMOS level
- Integrated Bootstrap Functionality
- PFC uses SiC SBD
- Independent Inverter and PFC Over-current Shutdown
- Under-voltage Lockout at all Channels
- Cross-conduction Prevention
- Fault Signal Output
- Independent Low Side IGBT Emitter
- Insulation withstand voltage grade: 2000 Vrms / min
- Built-in NTC thermistor for temperature monitor

Any Other Requirements?
Tell SHYSEMI, and we will be happy to answer your questions.
SHYSEMI is striving to become a world-leading semiconductor supplier.



