[SDIP-26] Fault outputs, insulation class: 2 kV / 1 min
2. The HVIC chip integrates a bootstrap diode with a current-limiting resistor
3. The high-side control voltage features undervoltage protection
4. The low-side LVIC features short-circuit current protection (SC), temperature output (TO), over-temperature protection (OTP), and undervoltage protection (UV)
5. Fault outputs (UV, SC, OTP) shut down the LVIC output when protection is triggered
6. Input interface compatible with 3.3 V & 5 V signals, active high
7. Insulation class: 2000 V rms / min
Product Details: SYIM15S60
The SDIP-26 package achieves an exceptional balance among pin count, mechanical strength, thermal performance, and compactness.
Its sturdy through-hole leads are soldered directly through the PCB, forming an extremely reliable mechanical and electrical connection.
This robust construction enables the SDIP-26 to withstand severe vibration, impact, and thermal cycling, which is why it continues to be widely adopted in industrial, automotive, and aerospace applications. Its reliability far exceeds that of most surface-mount packages.
Additionally, SDIP-26 pins can be easily inserted into standard IC sockets, making it highly convenient during R&D, prototyping, and maintenance phases. This feature simplifies testing and replacement procedures, reducing both development complexity and long-term service costs.
Internal Electrical Schematic:
