The DIP25 intelligent power module (IPM) is a highly integrated power device specifically designed for high-efficiency and high-reliability motor control. This module employs advanced packaging technology and material processes, integrating power devices and drive circuits within a compact structure. It significantly enhances system integration and heat dissipation performance, and is particularly suitable for space and energy efficiency-demanding applications in variable-frequency household appliances and industrial drives.
1.Product Overview
The DIP25 packaged intelligent power module launched by SHYSEMI is a high-performance power device that integrates a three-phase brushless DC motor drive circuit. Its core positioning is to provide stable and efficient drive support for low to medium power variable frequency equipment. Typical applications include household air conditioners, refrigerators, washing machines, and other scenarios that require compact installation and efficient motor control.
2.Key Product Features
Advanced packaging structure and materials
The DIP25 module uses a high-insulation and high-thermal-conductivity DBC (Direct Bonded Copper) substrate as the power device carrier layer, effectively enhancing insulation strength and thermal conductivity, ensuring that the power components maintain a low operating temperature under high load conditions. The driver IC part is equipped with a high-reliability copper frame substrate, which not only guarantees signal transmission quality but also enhances the structural stability of the module.
Integrated temperature detection function
The module provides an optional power side temperature detection pin, which can monitor the core temperature of the module in real time and accurately, providing critical thermal protection data for the system. This helps prevent performance degradation or component damage due to overheating, thereby further enhancing the overall reliability of the device.
Compact design, easy installation
The DIP25 package structure is extremely compact, achieving high-level functional integration within a limited space. The pin layout is reasonable, and the electrical pins are led out through a unified copper frame, significantly simplifying PCB design and overall assembly processes, especially suitable for scenarios with limited space and high power density requirements.
High integration and high reliability
This module integrates IGBT/MOSFET power devices, drive circuits, and necessary protection functions (such as overcurrent, short circuit and overheat protection) into a single package. By reducing the number of external components, it significantly enhances the system's anti-interference ability and operational consistency, and lowers the overall failure rate.
3.Typical Application Domains
- Household appliances: such as inverter air conditioners, refrigerator compressors, washing machine motor drives, etc.;
- Industrial control: small frequency converters, water pumps, fan drives and automation equipment;
- New energy vehicles: auxiliary drive systems, small compressor control, etc.
4.Why choose the DIP25 intelligent power module?
In the current context where household appliances and industrial equipment are constantly evolving towards higher efficiency, energy conservation, and miniaturization, the DIP25 intelligent power module, with its excellent heat dissipation performance, comprehensive protection functions, and outstanding integration, has become an ideal choice for developing highly reliable motor drive systems. It not only helps to shorten the research and development cycle but also significantly enhances the energy efficiency level and market competitiveness of the end products.
In conclusion, the DIP25 intelligent power module, with its compact packaging, efficient heat dissipation and high integration features, is widely applied in various variable frequency drive fields. It is an ideal solution for achieving efficient motor control and energy-saving design.