DIP-25 packages are preferred in scenarios where reliability, power capability, and ease of use take precedence over size constraints.
The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints.
Compared with ultra-high-density packages, DIP-25 features lower parasitic capacitance and inductance between pins. Designers benefit from greater routing flexibility on both sides and inner layers of the PCB, allowing for optimized power distribution and signal isolation.
