Shenhuaying Semiconductor, a leading power semiconductor manufacturer, has revealed its cutting-edge production process for IGBT modules. The company specializes in IGBT modules, SiC components, and IPMs.
The production process begins with die bonding, where nano silver paste is precisely applied to DBC ceramic substrates. IGBT chips are mounted with ultra-low thermal resistance connections, achieving a void rate below 3%. This ensures superior heat dissipation and long-term reliability in IGBT modules.
Next, wire bonding is performed using copper ultrasonic technology. Shenhuaying Semiconductor’s automated system completes 15 high-strength bonds per second, improving current capacity by 20%. The process is critical for maintaining consistency in SiC components and IPMs. Quality control includes X-ray inspection with 5μm resolution. The system detects solder voids and wire deformations, guaranteeing defect-free IGBT modules. Every unit undergoes 100% testing, including laser dimension checks and barcode traceability for full lifecycle management.
Final validation involves dynamic performance testing at 1500V/100A. Shenhuaying Semiconductor evaluates switching losses and short-circuit endurance, with all data stored in cloud-based traceability systems. These IGBT modules and SiC components meet the stringent demands of global automotive leaders.
To learn more about SHY Semi's IGBT modules, please visit https://www.shysemi.com/mid-high-power-f-series.
About Shenhuaying Semiconductor
Shenhuaying Semiconductor develops high-efficiency IGBT modules, SiC components, and IPMs for automotive and industrial applications, ensuring reliability and performance.