The 34mm IGBT module standard was primarily established by industry leaders such as Infineon, Fuji Electric, and Mitsubishi. SHYSEMI has now made significant breakthroughs in this technology. By employing the latest micro-pattern trench field-stop chip technology, the company produces thinner chips that substantially reduce both turn-on and turn-off losses (Eon/Eoff). Furthermore, through the use of high-performance thermal grease or even sintered connections to attach the chip directly to the substrate, thermal resistance is greatly minimized.

The 62mm IGBT module represents a highly mature and widely adopted standard for high-power applications. Its design integrates numerous advanced IGBT and diode chips to achieve exceptionally high current ratings. The high heat generated by these multiple chips is effectively dissipated through high-performance thermal interface materials and sintering technology.

Engineered for demanding 24/7 industrial operation in harsh environments—such as mines, steel mills, and offshore wind farms—this module offers significant system-level advantages. Specifically, compared to using several smaller modules in parallel, a single 62mm module simplifies the design of the gate drive circuit, cooling system, busbar connections, and protection circuitry, thereby lowering overall system integration costs.