In the context of the rapid development of motor drive technology nowadays, SHYSEMI has launched the DIP29 packaged intelligent power module, which represents the latest advancement in the industry. This highly integrated three-phase brushless DC motor drive solution, with its innovative packaging design and outstanding performance, is bringing revolutionary changes to medium and low power variable frequency drive applications.
Innovative Packaging Structure Design
This module adopts a three-layer composite packaging architecture, demonstrating remarkable engineering wisdom. The bottom layer uses a DBC substrate as the platform for power devices, and its unique alumina ceramic substrate achieves an insulation rate of up to 99%, while the thermal conductivity reaches 24W/(m·K), ensuring efficient heat dissipation of the power devices. The middle layer selects a FR-4 PCB board with a high TG value (180℃), integrating the driver IC and signal processing circuits. Its 8-layer precise wiring design ensures signal integrity protection. The top layer realizes electrical connection through a precisely formed copper frame.
Breakthrough Performance Advantages
Thermal Management: The thermal resistance (Rth(j-c)) of the module is as low as 0.5K/W. Combined with the uniform heat dissipation characteristics of the DBC substrate, it can reduce the junction temperature of power devices by 15-20°C, significantly enhancing system reliability. The measured data shows that when operating continuously at an ambient temperature of 25°C, the module's outer shell temperature can be stably controlled below 65°C.
Electrical Performance: It supports continuous operation at 600V/15A, with a maximum switching frequency of up to 20kHz. The integrated high-speed HVIC driver circuit achieves ns-level dead-time control, reducing switching losses by 30%. The built-in temperature detection circuit has an accuracy of ±3°C, and in combination with the patented protection algorithm, it can provide comprehensive protection against overcurrent, overtemperature, and undervoltage.
Diverse Application Scenarios
The compact design and powerful performance of this module enable it to excel in multiple fields:
- Industrial servo systems: Supports servo motor drives ranging from 0.75 to 3kW, with response time < 1ms
- Variable frequency household appliances: Compatible with air conditioning compressors and refrigerator variable frequency modules, with standby power consumption < 0.5W
- Energy storage: Applied in scenarios such as micro photovoltaic inverters and charging station cooling fans
- Automation equipment: Particularly suitable for mechanical arms and CNC machines in space-constrained environments
Engineering Application Value
This module adopts standardized pin definitions and is compatible with mainstream PCB layout designs. It provides a complete development kit, including reference design documents, SPICE models, and thermal simulation files, which can shorten the customer's development cycle by 40%. The module has passed UL certification and RoHS testing, with an MTBF exceeding 1 million hours. The operating temperature range covers -40°C to +125°C, meeting the requirements of industrial-level applications.
With the continuous advancement of intelligent manufacturing, SHYSEMI has been continuously optimizing the DIP29 packaging technology. The next-generation product will integrate current detection functionality and adopt SiC power devices, thereby increasing the power density by another 30%. This intelligent power module, with its outstanding integration and reliability, is redefining the industry standards for medium and low-power motor drives, providing more competitive solutions for equipment manufacturers.