• IPM

    DIP-29 Package

    The DIP-29 is a high-pin-count dual in-line package that inherits all the classic advantages of the DIP family while offering expanded I/O capability for more complex system designs.
    Despite featuring up to 29 leads, it retains the thick through-hole pins and rigid structure that characterize traditional DIP packages.
    When soldered through the PCB, these leads provide extremely durable mechanical bonding, ensuring long-term electrical integrity under demanding operating conditions.

    SYIM50D65

    • Package：DIP-29
    • Voltage(V): 650
    • Current(A): 50
    • VCE(sat)@Typ.Tj=25°C：1.7

  • Applications:

    The larger molded body of the DIP-29 also serves as an effective passive heat spreader. Its flat top and bottom surfaces allow for easy installation of clip-on or integrated heatsinks, and even direct thermal coupling with the chassis, unlocking substantial thermal dissipation potential.This combination of mechanical durability, thermal efficiency, and scalability makes the DIP-29 a preferred package for high-power or high-pin-count applications across industrial control, automotive electronics, and aerospace systems.

    • Refrigerator compressors
    • Low-power frequency converters
    • Industrial sewing machines
    • Air conditioning compressors

  • Features:

    • Built-in high-voltage drive circuit (HVIC).
    • The HVIC chip integrates a lift-off diode with a current-limiting resistor
    • The high-side control voltage has undervoltage protection
    • The low-side LVIC features short-circuit current protection (SC), temperature output (TO), over-temperature protection (OTP), and undervoltage protection (UV)
    • Fault outputs (UV, SC, OTP) "shut down" the LVIC output when protection is triggered.
    • Input interface compatible with 3.3 V and 5 V signals, active high
    • Insulation class: 2500 V rms / min
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