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SDIP26 Intelligent Power Module (IPM): A Complete Guide for Low-Power Motor Drive Applications

The SDIP26 Intelligent Power Module (IPM) is a compact, high-performance solution designed for low-power three-phase motor drive systems. Featuring a narrow-body Shrink Dual In-line Package (SDIP), it is widely adopted in home appliances, inverter-driven systems, and compact industrial applications.

With increasing demand for energy-efficient motor control, SDIP26 IPMs offer an ideal balance of integration, reliability, and cost-effectiveness.

modern inverter applications

Key Features of SDIP26 IPM

SHYSEMI’s SDIP26 package is engineered for high thermal efficiency and electrical safety, making it suitable for modern inverter applications:

  • DBC (Direct Bonded Copper) substrate for superior insulation and heat dissipation
  • High-reliability copper leadframe for stable driver IC performance
  • Optimized thermal design for higher power density in compact form factors
  • Built-in high-voltage gate driver IC (HVIC)
  • Integrated protection functions for enhanced system reliability
IPM product structure diagram

Product Overview: SDIP26 IPM for BLDC Motor Drives

Typical models such as SYIM15S60 IPM module integrate a three-phase brushless DC (BLDC) motor driver with advanced protection and control features.

These modules are ideal for:

  • Inverter air conditioners
  • Refrigerator compressors
  • Washing machine motor drives
  • Range hoods and ventilation systems

This makes SDIP26 a preferred solution for low-power inverter applications (≤1.5kW).

SDIP26 Package Specifications

  • Package Type: Shrink Dual In-line Package (SDIP26)
  • Pin Configuration: 26 pins (13 × 2 dual row)
  • Pin Pitch: 2.54 mm
  • Body Width: ~7.62 mm (300 mil)
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Design Advantages

  • Through-hole mounting for easy PCB assembly and wave soldering
  • Improved creepage distance and thermal performance vs standard DIP
  • Built-in insulated substrate (DBC/IMS)
  • Isolation voltage: ≥ 1.5–2.5 kVrms
  • Ideal for compact, low-cost motor drive designs
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Internal Architecture of SDIP26 IPM

Power Stage

  • 6 × IGBT + 6 × freewheeling diodes
  • Configured as a three-phase full-bridge inverter

Gate Driver Stage

  • High-side drivers (HVIC) for U/V/W phases
  • Low-side drivers (LVIC)
  • Integrated bootstrap diodes (no external components required)
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Protection Functions

  • UVLO (Under-Voltage Lockout)
  • SCP (Short-Circuit Protection)
  • TSD (Over-Temperature Shutdown)
  • FO (Fault Output, open-drain)
  • NTC temperature sensing / analog output (VOT)

Control Interface

  • Logic inputs: HIN / LIN (3.3V & 5V compatible)
  • Power supply: VCC, bootstrap supply
  • Power terminals: DC bus (P), phase outputs, GND

Why Choose SDIP26 Intelligent Power Modules?

1. High Integration

Combines IGBTs, gate drivers, and protection circuits into a single compact module, reducing BOM and design complexity.

2. Enhanced Safety

Full electrical isolation enables safe operation in high-voltage environments, ideal for appliance and industrial control boards.

3. Simplified Design

Compatible with MCUs (3.3V / 5V), eliminating the need for complex external driver circuits.

4. Built-in Protection

Integrated fault protection improves system robustness and long-term reliability.

5. Cost-Optimized Solution

Perfect for mass production in consumer electronics and low-power inverter systems.

Typical Applications of SDIP26 IPM

The SDIP26 IPM is widely used in:

  • Air conditioner inverter compressors
  • Refrigerator variable-speed compressors
  • Washing machine motor control systems
  • Low-power VFDs (≤ 1.5 kW)
  • Fan, pump, and small servo motor drives

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