• IPM-DIP-26 Package

  • What are the differences of SHYSEMI's DIP-26 product?

    The DIP-26 can be regarded as a reinforced, power-grade dual in-line package. Its key advantage lies in its wider pin pitch compared with standard DIP or SOP packages. The increased pin spacing directly provides greater creepage and clearance distances, which effectively prevent arcing or short-circuiting between adjacent pins under high-humidity or contaminated conditions.

  • Choose the Model

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    SYIM676-DGT: 600V/20A, 3Φ, built-in bootstrap circuit, OCP/UVLO/Fault Protection, with NTC
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    SYIM676-DG: 600V/20A, 3Φ, includes OCP, OTP, and UVLO protections with excellent EMI performance
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    SYIM656-DGT: 600V/15A, Three-phase full bridge IPM, equipped with IGBT, self-boost cicircuit, NTC
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    SYIM656-DG: 600V/15A, 3Φ, Fully insulated, high heat dissipation, integrating drive function
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