In sectors like industrial motor drives, frequency-conversion home appliances, and renewable energy, the Intelligent Power Module (IPM) is the heart of system performance, efficiency, and long-term stability.
SHYSEMI stands at the forefront of power semiconductors. By controlling the entire supply chain—from chip design to proprietary packaging—we offer the industry’s most comprehensive range of IPM solutions. Our goal is to provide a "one-stop" high-reliability power platform that exceeds global engineering expectations.
SHYSEMI's integrated semiconductor solution: From wafer fabrication to advanced IPM packaging.
1. Vertical Integration: The Foundation of Chip-to-Package Reliability
At SHYSEMI, reliability is engineered into the product from the very first silicon wafer:
- Diverse Packaging Matrix: We offer an extensive portfolio of IPM packages, ranging from compact DIP modules for consumer electronics to large-scale modules for heavy industrial use. This variety ensures maximum design flexibility for your PCB layout.
- Self-Owned Manufacturing & Top-Tier Foundry: SHYSEMI operates its own dedicated packaging and testing facilities to ensure 100% process control. Our core chips are fabricated by Hua Hong Group (ranked 6th globally in wafer foundries), guaranteeing world-class wafer consistency and quality.
- Industrial-Grade Quality Control: Our rigorous testing protocols cover design, fabrication, and stress testing. Every SHYSEMI IPM is built to thrive in extreme environments, including high humidity, intense vibration, and thermal cycling, with an MTBF (Mean Time Between Failures) that significantly outperforms industry standards.
A corner of the SHYSEMI warehouse
2. Beyond Inversion: 6 Core Technical Advantages
Unlike standard off-the-shelf modules, SHYSEMI integrates advanced features that simplify system architecture and boost power density.
I. Integrated PFC and Full-Bridge Inversion
Our unique solution integrates Power Factor Correction (PFC) circuits and a three-phase inverter bridge into a single module. This reduces peripheral component count (BOM cost), saves PCB space, and optimizes system-level energy efficiency to meet the world’s strictest environmental regulations.
II. Advanced IMS (Insulated Metal Substrate)
We have transitioned from traditional DBC ceramic substrates to high-performance IMS (Insulated Metal Substrate).
- Superior Thermal Conductivity: Enhances heat dissipation, allowing for higher power density.
- Mechanical Durability: IMS offers better resistance to thermal shock and physical vibration, drastically extending the module’s operational lifespan.
III. Proprietary 7-Channel Driver IC with Integrated Bootstrap
SHYSEMI utilizes an in-house developed 7-channel high-voltage driver IC. By integrating the Bootstrap Diode and resistor internally, we eliminate the need for external components. This simplifies the application circuit and enhances overall system integration.
IV. Hardware-Level Interlock Protection
To prevent fatal "shoot-through" (where upper and lower bridge arms turn on simultaneously), our driver IC includes Hardware Interlock Protection. It monitors signals in real-time to ensure they never overlap, eliminating the risk of catastrophic failure caused by logic errors or EMI noise—a critical safety feature often missing in basic 3-channel solutions.
V. Ultra-Fast Fault Feedback (FLT)
Speed is the ultimate protection. SHYSEMI IPMs feature a lightning-fast response mechanism:
- Fault Trigger Delay (~700ns): In the event of an overcurrent or short circuit, the module shuts down in microseconds to protect the power chips.
- Fault Clear Recovery (~1700ns): Once the fault is cleared, the system resets rapidly, minimizing downtime and ensuring continuous operation.
VI. Precision NTC Temperature Monitoring
We place the NTC Thermistor directly on the IMS substrate, positioned at the thermal center of the power chips. This allows for direct sensing of the Junction Temperature ($T_j$). Unlike designs that place the NTC on the outer casing, our method provides the most accurate data for real-time over-temperature protection.
Conclusion
A SHYSEMI IPM is more than just a component; it is a highly integrated, "plug-and-play" system-level solution. By mastering the entire lifecycle—from Hua Hong wafer fabrication to proprietary IC design—we maintain total quality sovereignty.
Whether you are designing for high power density or mission-critical reliability, SHYSEMI provides the competitive edge through integrated PFC, IMS technology, and intelligent protection.
Ready to upgrade your power architecture?
[Contact our engineering team today for a datasheet or sample request.]