A watershed in power semiconductor technology, the 6th-generation Trench Field Stop (TFS) process delivers an optimal balance of blocking voltage, conduction loss, and switching speed, establishing the definitive state-of-the-art for silicon FRDs.

SHYSEMI leverages this process to develop its 1200 V and 1700 V product series, which features a uniform die size for manufacturing efficiency. The chips are taped out by Huahong Group, the world's sixth-largest global foundry.