• FRD Chip

    Wafer Size: 1700V = 1200V

  • What are the outstanding features of SHYSEMI's FRD chips?

    A watershed in power semiconductor technology, the 6th-generation Trench Field Stop (TFS) process delivers an optimal balance of blocking voltage, conduction loss, and switching speed, establishing the definitive state-of-the-art for silicon FRDs.

    SHYSEMI leverages this process to develop its 1200 V and 1700 V product series, which features a uniform die size for manufacturing efficiency. The chips are taped out by Huahong Group, the world's sixth-largest global foundry.

  • Choose the Model

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    SYF150P120A6S2: 1200V 150A FRD chip, 1.85V low VF, parallel-friendly for industrial drives
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    SYF100P65E2: 750V 200A FRD chip, 0.75V ultra‑low VF, soft recovery for industrial drives
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    SYF150P170E1: 1700V 150A FRD chip, 2V low VF, soft switching, for high‑power inverters.
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    SYF100P170E1: 1700V 100A FRD chip, 1.9V low VF, soft switching, for high‑power converters
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    SYF60P170E1: 1700V 60A FRD chip, 2V low VF, high frequency, for medium/high voltage converters
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    SYF200P120A6K1: 1200V 200A FRD chip, 2.05V low VF, high frequency, for industrial drives & inverters
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    SYF150FD120MR: 1200V 150A FRD chip, 2.2V low VF, high frequency, for welding & solar inverters.
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    SYF100P120A6F: 1200V 100A FRD chip, 2V low VF, high frequency, for UPS & solar inverters
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    SYF60P120A6K1: 1200V 60A FRD chip, 1.7V low VF, high frequency, for motor drives & solar inverters
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    SYF200P170CBK: 1700V 200A FRD chip, 2V low VF, soft switching, for wind power converters
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