IPM-DIP-25

The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use. The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints. This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions. Compared with ultra-high-density packages, DIP-25 features lower parasitic capacitance and inductance between pins. Designers benefit from greater routing flexibility on both sides and inner layers of the PCB, allowing for optimized power distribution and signal isolation. This makes it an ideal choice for noise-sensitive analog circuits or high-voltage digital systems, where stability and long-term reliability are essential.