IPM-DIP26

The DIP-26 can be regarded as a reinforced or power-grade dual in-line package. Its key advantage lies in its wider pin pitch compared with standard DIP or SOP packages. The increased pin spacing directly provides longer creepage and clearance distances, which effectively prevent arcing or short-circuiting between adjacent pins under high-humidity or contaminated conditions. This design feature greatly improves system reliability and safety in high-voltage environments, making it ideal for applications that must withstand hundreds or even thousands of volts over extended operation periods.