As one of SHYSEMI's classic and mature package platforms, DIP-24 benefits from decades of proven manufacturing and soldering process reliability, ensuring high production yield and minimal operational risk.

Features:

• Integrated 6 low-loss IGBTs
• Integrated high voltage gate drive circuit (HVIC)
• Built-in under voltage protection and over temperature, over current protection and temperature output
• Built-in fast recovery bootstrap diode with current limiting resistor
• Insulation class 1500 Vrms / min
• High reliability and thermal stability,good parameter consistency
• Built-in temperature output