Its key advantage lies in its wider pin pitch compared with standard DIP or SOP packages. The increased pin spacing directly provides greater creepage and clearance distances, which effectively prevent arcing or short-circuiting between adjacent pins under high-humidity or contaminated conditions.
This design feature greatly improves system reliability and safety in high-voltage environments, making it ideal for applications that must withstand hundreds or even thousands of volts over extended operation periods.

Features:

• Fully insulated Double in line power module,integrated with 3Φ full bridge
• Using lMS insulated and heat-dissipating substrate
• DlP(Double in line)fully insulated packagestructure is adopted
• Active high, compatible with TTL / CMOS level
• Integrated bootstrap functionality
• Independent inverter over-current shutdown
• Under-voltage lockout at all channels
• Cross-conduction prevention
• Fault signal output
• Independent low side lGBT emitter