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We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

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    • Home
    • Products 
      • IPM
      • IGBT Modules
      • IGBT Discretes
      • IGBT Chips
      • SiC
      • FRD(MUR)
      • Bridge Rectifier
    • Application 
      • New Energy Vehicle
      • Home Appliance
      • Energy Storage
      • Industrial Equipment
      • Data Centers
    • Technology
    • Our Teams
    • Blog
    • Contact Us
Sample Request
WhatsApp: +86 153 6155 4542
info@shysemi.com
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.

Less Energy

More Efficiency

  • Home
  • Products 
    • IPM
    • IGBT Modules
    • IGBT Discretes
    • IGBT Chips
    • SiC
    • FRD(MUR)
    • Bridge Rectifier
  • Application 
    • New Energy Vehicle
    • Home Appliance
    • Energy Storage
    • Industrial Equipment
    • Data Centers
  • Technology
  • Our Teams
  • Blog
  • Contact Us
  • …  
    • Home
    • Products 
      • IPM
      • IGBT Modules
      • IGBT Discretes
      • IGBT Chips
      • SiC
      • FRD(MUR)
      • Bridge Rectifier
    • Application 
      • New Energy Vehicle
      • Home Appliance
      • Energy Storage
      • Industrial Equipment
      • Data Centers
    • Technology
    • Our Teams
    • Blog
    • Contact Us
Sample Request
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
  • IPM

    SDIP-25 Package

    The SDIP, is a narrow-pitch variant of the standard DIP package.By reducing pin spacing, it retains the core advantages of the DIP family—ease of handling, robustness, and thermal performance—while providing a more compact form factor.

    This makes SDIP an ideal choice for applications requiring a higher number of I/O pins under PCB space constraints. Its standardized rectangular geometry also facilitates the installation of clip-on heatsinks, ensuring efficient heat dissipation without compromising board layout efficiency.

    SYIM06S60

    • Package:SDIP-25FP
    • Voltage(V): 600
    • Current(A): 6
    • RDS(on)@Typ.Tj=25°C: 2.0
    Specification

    SYIM10S60

    • Package:SDIP-25FP
    • Voltage(V): 600
    • Current(A): 10
    • RDS(on)@Typ.Tj=25°C: 2.0
    Specification
  • Applications:

    Leveraging its balance of reliability, thermal performance, and pin count, the SDIP-25 package is often employed in industrial and high-end applications where extreme miniaturization is not the priority.

    • Frequency converter
    • Air Conditioning compressor
    • Air cleaner
    • Dish washer
    • Cooker hood

  • Features:

    • Integrated 6 fast recovery power MOSFETs (500 V / 5 A)
    • Integrated high voltage gate drive circuit
    • Compatible with 3.3 V & 5 V input signal, effective at high level
    • Integrated temperature output
    • Built-in quick recovery bootstrap diode
    • Insulation class 1500 V rms / min
    • Integrated bootstrap functionality
    • High reliability and thermal stability, good parameter consistency
    Section image

SHYSEMI is striving to become a world-leading semiconductor supplier.

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