IPM-SOP-23 Package

The SOP-23 (Small Outline Package) is a surface-mount package, with leads extending from the sides rather than passing through the PCB.This design yields a much smaller footprint than any DIP package, enabling significant PCB space savings and supporting miniaturization and lightweight design in modern electronics. It allows complex circuitry to be integrated into a smaller board area.

Intelligent Power Modules (IPM) are widely used in industrial motor drive and inverter systems due to their high integration, built-in protection and stable performance.