• IPM

    SOP-23 Package

    The SOP-23 (Small Outline Package) is a surface-mount package, with leads extending from the sides rather than passing through the PCB.
    This design yields a much smaller footprint than any DIP package, enabling significant PCB space savings and supporting miniaturization and lightweight design in modern electronics. It allows complex circuitry to be integrated into a smaller board area.

    SYIM03M60ATD

    • Package：SOP-23H
    • Voltage(V): 600
    • Current(A): 3
    • RDS(on)@Typ.Tj=25°C: 2.5

    SYIM05M50BTD

    • Package：SOP-23H
    • Voltage(V): 500
    • Current(A): 5
    • RDS(on)@Typ.Tj=25°C: 1.3

    SYIM06G60BTD

    • Package：SOP-23H
    • Voltage(V): 600
    • Current(A): 6
    • RDS(on)@Typ.Tj=25°C:

  • Applications:

    Despite its compact size, the SOP-23 package typically employs thermally conductive encapsulation materials, and its exposed thermal pad can be directly soldered to the PCB copper layer for efficient heat dissipation.

    • Frequency converter
    • Air Conditioning compressor
    • Air cleaner
    • Dish washer
    • Cooker hood

  • Features:

    • Integrated high voltage gate drive circuit
    • Compatible with 3.3 V & 5 V input signal, effective at high level
    • Integrated temperature output
    • Built-in quick recovery bootstrap diode
    • Insulation class 1500V rms / min
    • Integrated bootstrap functionality
    • High reliability and thermal stability, good parameter consistency
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