• IPM

    DIP-23 Package

    The DIP-23 package retains the inherent advantages of the traditional DIP format—reliability, thermal performance, and ease of assembly—while introducing a unique odd-number pin configuration tailored to specific IC architectures.It represents a function-specific and cost-optimized packaging solution rather than a universal one.Due to its unique configuration, the DIP-23 package is typically used for function-specific ICs.

    SYIM03M60ATA

    • Package：DIP-23H
    • Voltage(V): 600
    • Current(A): 3
    • RDS(on)@Typ.Tj=25°C: 2.5

    SYIM05M50BTA

    • Package：DIP-23H
    • Voltage(V): 600
    • Current(A): 5
    • RDS(on)@Typ.Tj=25°C: 1.3

    SYIM06G60BTA

    • Package：DIP-23H
    • Voltage(V): 600
    • Current(A): 6
    • RDS(on)@Typ.Tj=25°C:

  • Applications:

    DIP-23 package represents a function-specific and cost-optimized packaging solution rather than a universal one.
    When a chip adopts the DIP-23 package, it signifies that the designer has achieved an optimal balance between functionality and cost, creating a precisely customized solution for that device's intended performance.

    • Frequency converter
    • Air Conditioning compressor
    • Air cleaner
    • Dish washer
    • Cooker hood
    • Refrigerator compressor

  • Features:

    • Integrated 6 fast recovery power MOSFETs
    • Integrated high voltage gate drive circuit
    • Compatible with 3.3 V & 5 V input signal, effective at high level
    • Integrated temperature output
    • Built-inquick recovery boot strap diode
    • Insulation class 1500 Vrms / min
    • Integrated bootstrap functionality
    • High reliability and thermal stability, good parameter consistency
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