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- IGBT Modules
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- New Energy Vehicle
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- …
- Products
- IPM
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- New Energy Vehicle
- Home Appliance
- Energy Storage
- Industrial Equipment
- Data Centers
Less Energy
More Efficiency
- Products
- IPM
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- New Energy Vehicle
- Home Appliance
- Energy Storage
- Industrial Equipment
- Data Centers
- …
- Products
- IPM
- IGBT Modules
- IGBT Discretes
- IGBT Chips
- SiC
- FRD(MUR)
- Bridge Rectifier
- Application
- New Energy Vehicle
- Home Appliance
- Energy Storage
- Industrial Equipment
- Data Centers
IGBT Modules
Low Power N Series
The low-power N series of SHYSEMI is available in three packaging forms: EasyPIM1, EasyPIM2, and SOT-227. This is a highly integrated "plug-and-play" type intelligent power module package. Its core advantages can be summarized as follows: providing a simple, fast and low-risk system-level solution for compact, high-reliability and mass-produced variable frequency and inverter applications.
Package List
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EasyPIM1
As products frequently used in everyday applications, SHYSEMI's low-power modules feature low switching and conduction losses.

EasyPIM2
SHYSEMI applies silver plating to the pins to improve solderability and extend storage life, Press-fit pin technology is also available as an optional process.

SOT-227
By adopting moderate chip technology, the on-state loss and off-state loss are balanced. The system design is mature and does not require additional monitoring or protection functions.
EasyPIM1 Applications:
The principal advantage of the EasyPIM module is its integration of the majority of power components necessary for a complete three-phase inverter or frequency converter into a single compact package. Its internal layout is meticulously engineered to achieve extremely low parasitic inductance. This design effectively suppresses switching overvoltage and electromagnetic interference, thereby ensuring enhanced system stability.
- Industrial Inverters
- Servo Applications
SYMT10PI120B3H
- Package:EasyPIM1
- Voltage(V): 1200
- Current(A): 10
- VCE(SAT)@typ.Tj=25°C: 1.9
- VGEth@typ.Tj=25°C: 5.5
SYMT15PI120B3H
- Package:EasyPIM1
- Voltage(V): 1200
- Current(A): 15
- VCE(SAT)@typ.Tj=25°C: 1.9
- VGEth@typ.Tj=25°C: 5.8
Features:
- Field Stop Trench Gate IGBT
- Short Circuit Rated >10μs
- Low Saturation Voltage
- Low Switching Loss
- 100% RBSOA Tested (2×Ic)
- Low Stray Inductance
- Lead Free, Compliant with RoHS Requirement

EasyPIM2 Applications:
Compared to solutions that employ multiple discrete modules, SHYSEMI's EasyPIM integrates all the required functionalities into a single, compact unit. This integration dramatically reduces the required PCB footprint. It is therefore particularly suited for space-constrained applications, including household appliances and compact industrial equipment. Furthermore, the layout of both the power and signal circuits is greatly simplified, rendering it highly intuitive and mitigating the design risks associated with high-frequency PCB layout.
- Motor DrivesAir
- Conditioning
- Servo Drives
- UPS
- Auxiliary Inverters
SYMT25PI120B9H
- Package:EasyPIM2
- Voltage(V): 1200
- Current(A): 25
- VCE(SAT)@typ.Tj=25°C: 1.95
- VGEth@typ.Tj=25°C: 5.6
SYMT40FF120B3H
- Package:EasyPIM2
- Voltage(V): 1200
- Current(A): 40
- VCE(SAT)@typ.Tj=25°C: 2.0
- VGEth@typ.Tj=25°C: 5.8
Features:
- Field Stop Trench Gate IGBT
- Short Circuit Rated >10μs
- Low Saturation Voltage
- Low Switching Loss
- 100% RBSOA Tested (2×Ic)
- Low Stray Inductance
- Lead Free, Compliant with RoHS Requirement

SOT-227 Applications:
The SOT-227 from SHYSEMI stands as one of the most classic and widely utilized package formats in industrial-grade power semiconductor modules. It incorporates a robust metal substrate that serves both for heat dissipation and mechanical support, paired with a high-strength plastic housing capable of withstanding substantial mechanical and thermal stresses. Internally, the module employs a direct bonded copper (DBC) or similar substrate, where the semiconductor die is attached via a reliable soldering process. This configuration endows the module with exceptional power cycling and temperature cycling capabilities, ensuring an operational lifespan spanning several decades.
- Industrial Inverters
- UPS
- Drives
Features:
- Fast and Soft Recovery
- Low Irr and Qrr

SHYSEMI is striving to become a world-leading semiconductor supplier.





