SOP23

DIP23

DIP29

SDIP26

SIP35

SIP35

[DIP-23] 3-Ph Full-Bridge, bootstrap functionality, customizable

Chips: IGBT Topological Function: Three-phase full-bridge Typical Application: Air conditioning fan, dishwasher, high-speed blower, low-power motor

DIP-24: Built-in UVLO, OTP, OCP, and temperature sensing

Chips: IGBT Topological Function: Three-phase full-bridge Typical Application: Air conditioning fan, dishwasher, high-speed blower, low-power motor

[DIP-25] Insulation class: 1.5V / 1 min, bootstrap functionality

Voltage: 600V Current: 10A Integrated 6 fast recovery power MOSFETs Integrated high voltage gate drive circuit Compatible with 3.3 V & 5 V input signal, effective at high level Integrated temperature output Built-inquick recovery boot strap diode Insulation class 1500 Vrms / min Integrated bootstrap functionality High reliability and thermal stability, good parameter consistency

[DIP-26] UVLO on all channels, Cross-conduction protection

* Prices fluctuate slightly with the market. Chips: IGBT Topological Function: Three-phase full-bridge Frequency: 20 kHz and below, with temperature detection Typical Application: Frequency converters and inverters

[DIP-29] HVIC, SC, TO, OTP, UV, Bootstrap circuit (diode + resistor) on-chip

Voltage: 650V Current: 50A Chips: IGBT Topological Function: Three-phase full-bridge Typical Application: Air conditioning compressor, freezer compressor, Low-power frequency converter and industrial sewing machine.

[SIP-35] Independent OC Shutdown, Active-high (TTL/CMOS), UVLO

* Prices fluctuate slightly with the market. Voltage: 600V Current: 15-20A Chips: IGBT Topological Function: PFC + Three-phase full-bridge PFC: SiC-SBD, 600V/30-40A (100 kHz and below) Function: With temperature detection Typical Application: Air conditioning compressor, frequency converter and inverter.

[SOP-23] HV gate driver, temperature sensing, and bootstrap diode

* Prices fluctuate slightly with the market. Voltage: 500-600V Current: 3-5A Chips: IGBT Topological Function: Three-phase full-bridge Frequency: 20 kHz and below, with temperature detection Typical Application: Frequency converters and inverters

[SDIP-26] HVIC chip with integrated bootstrap circuit, OTP, SC, TO

1. Built-in High Voltage Drive Circuit (HVIC). 2. The HVIC chip integrates a bootstrap diode with a current-limiting resistor 3. The high-side control voltage features undervoltage protection 4. The low-side LVIC features short-circuit current protection (SC), temperature output (TO), over-temperature protection (OTP), and undervoltage protection (UV) 5. Fault outputs (UV, SC, OTP) shut down the LVIC output when protection is triggered 6. Input interface compatible with 3.3 V & 5 V signals, active high 7. Insulation class: 2000 V rms / min

DIP24

The DIP-24 package features robust through-hole leads and a solid encapsulated body, capable of withstanding substantial mechanical stress and vibration. The interconnections are extremely secure. As one of SHYSEMI's classic and mature package platforms, DIP-24 benefits from decades of proven manufacturing and soldering process reliability, ensuring high production yield and minimal operational risk. Compared with ultra-dense packages, DIP-24 offers lower parasitic capacitance and inductance between pins, which enhances signal stability in noise-sensitive analog or mid-to-low frequency digital circuits.

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IPM-DIP-25

The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use. The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints. This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions. Compared with ultra-high-density packages, DIP-25 features lower parasitic capacitance and inductance between pins. Designers benefit from greater routing flexibility on both sides and inner layers of the PCB, allowing for optimized power distribution and signal isolation. This makes it an ideal choice for noise-sensitive analog circuits or high-voltage digital systems, where stability and long-term reliability are essential.

F1

IGBT Module - Medium and High Power F Series

IPM-DIP26

The DIP-26 can be regarded as a reinforced or power-grade dual in-line package. Its key advantage lies in its wider pin pitch compared with standard DIP or SOP packages. The increased pin spacing directly provides longer creepage and clearance distances, which effectively prevent arcing or short-circuiting between adjacent pins under high-humidity or contaminated conditions. This design feature greatly improves system reliability and safety in high-voltage environments, making it ideal for applications that must withstand hundreds or even thousands of volts over extended operation periods.