DIP23

SDIP26

SIP35

SOP23

SIP35

DIP29

For function-specific ICs, customizable

Due to its unique configuration, the DIP-23 package is typically used for function-specific ICs, such as: High-precision analog devices requiring multiple independent power or ground connections (e.g., precision op-amps and data converters). Custom or driver ICs with pin counts between DIP-22 and DIP-24, tailored for specific functional requirements. Legacy power semiconductors or linear regulators emphasizing thermal performance and reliability. In addition, SHYSEMI's DIP-23 package is also applied in air conditioner fan motors, dishwashers, high-speed dryers, and small-capacity motors, combining proven mechanical robustness with cost-effective design.

Lower parasitic capacitance and inductance between pins

As one of SHYSEMI's classic and mature package platforms, DIP-24 benefits from decades of proven manufacturing and soldering process reliability, ensuring high production yield and minimal operational risk.

Capable of withstanding harsh environments

The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use. The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints. This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions.

High isolation voltage and strong drive capability perfectly

Its key advantage lies in its wider pin pitch compared with standard DIP or SOP packages. The increased pin spacing directly provides greater creepage and clearance distances, which effectively prevent arcing or short-circuiting between adjacent pins under high-humidity or contaminated conditions. This design feature greatly improves system reliability and safety in high-voltage environments, making it ideal for applications that must withstand hundreds or even thousands of volts over extended operation periods.

Good heat dissipation

The DIP-29 is a high-pin-count dual in-line package that inherits all the classic advantages of the DIP family while offering expanded I/O capability for more complex system designs. Despite featuring up to 29 leads, it retains the thick through-hole pins and rigid structure that characterize traditional DIP packages. When soldered through the PCB, these leads provide extremely durable mechanical bonding, ensuring long-term electrical integrity under demanding operating conditions. The larger molded body of the DIP-29 also serves as an effective passive heat spreader. Its flat top and bottom surfaces allow for easy installation of clip-on or integrated heatsinks, and even direct thermal coupling with the chassis, unlocking substantial thermal dissipation potential. This combination of mechanical durability, thermal efficiency, and scalability makes the DIP-29 a preferred package for high-power or high-pin-count applications across industrial control, automotive electronics, and aerospace systems.

High-power, high-density, and high-reliability applications.

The SIP-35 package is specifically engineered for high-power, high-density, and high-reliability applications. SHYSEMI has optimized its internal structure to achieve ultra-low parasitic inductance and on-resistance (R<sub>DS(on)</sub>), which are critical for high-frequency switching applications such as switch-mode power supplies (SMPS) and inverters. These optimizations significantly reduce switching losses and voltage overshoot, enhancing overall system efficiency and reliability. The SIP-35 package typically features a single-screw mounting design, enabling easy installation and uniform pressure distribution. This ensures excellent thermal contact between the package and the heatsink, improving heat dissipation and long-term operational stability.

Supporting miniaturization and lightweight design

The SOP-23 (Small Outline Package) is a surface-mount package, with leads extending from the sides rather than passing through the PCB. This design yields a much smaller footprint than any DIP package, enabling significant PCB space savings and supporting miniaturization and lightweight design in modern electronics. It allows complex circuitry to be integrated into a smaller board area. Despite its compact size, the SOP-23 package typically employs thermally conductive encapsulation materials, and its exposed thermal pad can be directly soldered to the PCB copper layer for efficient heat dissipation.

Withstand severe vibration, impact, thermal cycling

The SDIP-26 package achieves an exceptional balance among pin count, mechanical strength, thermal performance, and compactness. Its sturdy through-hole leads are soldered directly through the PCB, forming an extremely reliable mechanical and electrical connection. This robust construction enables the SDIP-26 to withstand severe vibration, impact, and thermal cycling, which is why it continues to be widely adopted in industrial, automotive, and aerospace applications. Its reliability far exceeds that of most surface-mount packages. Additionally, SDIP-26 pins can be easily inserted into standard IC sockets, making it highly convenient during R&D, prototyping, and maintenance phases. This feature simplifies testing and replacement procedures, reducing both development complexity and long-term service costs.

DIP24

The DIP-24 package features robust through-hole leads and a solid encapsulated body, capable of withstanding substantial mechanical stress and vibration. The interconnections are extremely secure. As one of SHYSEMI's classic and mature package platforms, DIP-24 benefits from decades of proven manufacturing and soldering process reliability, ensuring high production yield and minimal operational risk. Compared with ultra-dense packages, DIP-24 offers lower parasitic capacitance and inductance between pins, which enhances signal stability in noise-sensitive analog or mid-to-low frequency digital circuits.

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IPM-DIP-25

The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use. The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints. This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions. Compared with ultra-high-density packages, DIP-25 features lower parasitic capacitance and inductance between pins. Designers benefit from greater routing flexibility on both sides and inner layers of the PCB, allowing for optimized power distribution and signal isolation. This makes it an ideal choice for noise-sensitive analog circuits or high-voltage digital systems, where stability and long-term reliability are essential.

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IGBT Module - Medium and High Power F Series

IPM-DIP26

The DIP-26 can be regarded as a reinforced or power-grade dual in-line package. Its key advantage lies in its wider pin pitch compared with standard DIP or SOP packages. The increased pin spacing directly provides longer creepage and clearance distances, which effectively prevent arcing or short-circuiting between adjacent pins under high-humidity or contaminated conditions. This design feature greatly improves system reliability and safety in high-voltage environments, making it ideal for applications that must withstand hundreds or even thousands of volts over extended operation periods.