The DIP-24 package features robust through-hole leads and a solid encapsulated body, capable of withstanding substantial mechanical stress and vibration. The interconnections are extremely secure.
As one of SHYSEMI's classic and mature package platforms, DIP-24 benefits from decades of proven manufacturing and soldering process reliability, ensuring high production yield and minimal operational risk.
Compared with ultra-dense packages, DIP-24 offers lower parasitic capacitance and inductance between pins, which enhances signal stability in noise-sensitive analog or mid-to-low frequency digital circuits.