Features:

• Almost no switching loss
• Negligible reverse recovery
• High surge current capabilit
• Higher switching frequency
• System efficiency improvement
• Positive Temperature Coefficient
• Temperature-Independent Switching
• Low heat dissipation requirements
• RoHS Halogen-free/Rohs compliant

SHYSEMI's SOT-227 package features a military-grade rugged structure. Internally, it employs a Direct Bonded Copper (DBC) substrate and anti-fatigue soldering technology, endowing it with power cycling capabilities that far exceed those of conventional packages. Its typical lifespan can exceed 100,000 temperature cycles, ensuring long-term stable operation even in harsh industrial environments.

Furthermore, the package utilizes a "stacked busbar" design, with power terminals (DC+, DC-, AC output) arranged in parallel. This configuration enables loop inductance as low as 10nH, a critical feature for modern high-speed IGBTs and SiC MOSFETs as it effectively suppresses switching overvoltage and oscillations.