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WhatsApp: +86 153 6155 4542
info@shysemi.com
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
Less Energy
More Efficiency
  • Home
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We design and manufacture semiconductor chips, discrete power devices, and power modules for your products.
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[SDIP-26] HVIC chip with integrated bootstrap circuit, OTP, SC, TO

[SDIP-26] HVIC chip with integrated bootstrap circuit, OTP, SC, TO

1. Built-in High Voltage Drive Circuit (HVIC).
2. The HVIC chip integrates a bootstrap diode with a current-limiting resistor
3. The high-side control voltage features undervoltage protection
4. The low-side LVIC features short-circuit current protection (SC), temperature output (TO), over-temperature protection (OTP), and undervoltage protection (UV)
5. Fault outputs (UV, SC, OTP) shut down the LVIC output when protection is triggered
6. Input interface compatible with 3.3 V & 5 V signals, active high
7. Insulation class: 2000 V rms / min
More Details

Product Details: SYIM15S60

The SDIP-26 package achieves an exceptional balance among pin count, mechanical strength, thermal performance, and compactness.
Its sturdy through-hole leads are soldered directly through the PCB, forming an extremely reliable mechanical and electrical connection.
This robust construction enables the SDIP-26 to withstand severe vibration, impact, and thermal cycling, which is why it continues to be widely adopted in industrial, automotive, and aerospace applications. Its reliability far exceeds that of most surface-mount packages.

Additionally, SDIP-26 pins can be easily inserted into standard IC sockets, making it highly convenient during R&D, prototyping, and maintenance phases. This feature simplifies testing and replacement procedures, reducing both development complexity and long-term service costs.

Internal Electrical Schematic: 

 

SDIP-26: Withstand severe impact, thermal cycling

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