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[DIP-25] Insulation class: 1.5V / 1 min, bootstrap functionality
Voltage: 600V
Current: 10A
Integrated 6 fast recovery power MOSFETs
Integrated high voltage gate drive circuit
Compatible with 3.3 V & 5 V input signal, effective at high level
Integrated temperature output
Built-inquick recovery boot strap diode
Insulation class 1500 Vrms / min
Integrated bootstrap functionality
High reliability and thermal stability, good parameter consistency
Current: 10A
Integrated 6 fast recovery power MOSFETs
Integrated high voltage gate drive circuit
Compatible with 3.3 V & 5 V input signal, effective at high level
Integrated temperature output
Built-inquick recovery boot strap diode
Insulation class 1500 Vrms / min
Integrated bootstrap functionality
High reliability and thermal stability, good parameter consistency
More Details
Product Details: SYIM10G60BTE
The DIP-25 refers to a dual in-line package with 25 pins. Its value lies not in miniaturization, but in its outstanding robustness, reliability, and ease of use.
The through-hole solder joints provide a mechanically secure structure capable of enduring strong vibration, mechanical shock, and repeated temperature cycles—conditions that often cause fatigue cracks in surface-mount joints.
This makes the DIP-25 package indispensable in industrial, automotive, and aerospace systems operating under harsh environmental conditions.
Internal Electrical Schematic:
