Product Details: SYIM50D65

The DIP-29 is a high-pin-count dual in-line package that inherits all the classic advantages of the DIP family while offering expanded I/O capability for more complex system designs.
Despite featuring up to 29 leads, it retains the thick through-hole pins and rigid structure that characterize traditional DIP packages.
When soldered through the PCB, these leads provide extremely durable mechanical bonding, ensuring long-term electrical integrity under demanding operating conditions.

The larger molded body of the DIP-29 also serves as an effective passive heat spreader. Its flat top and bottom surfaces allow for easy installation of clip-on or integrated heatsinks, and even direct thermal coupling with the chassis, unlocking substantial thermal dissipation potential.
This combination of mechanical durability, thermal efficiency, and scalability makes the DIP-29 a preferred package for high-power or high-pin-count applications across industrial control, automotive electronics, and aerospace systems.

Features:

• Built-in high-voltage drive circuit (HVIC).
• The HVIC chip integrates a lift-off diode with a current-limiting resistor
• The high-side control voltage has undervoltage protection
• The low-side LVIC features short-circuit current protection (SC), temperature output (TO), over-temperature protection (OTP), and undervoltage protection (UV)
• Fault outputs (UV, SC, OTP) "shut down" the LVIC output when protection is triggered.
• Input interface compatible with 3.3 V and 5 V signals, active high
• Insulation class: 2500 V rms / min

Internal Electrical Schematic: