• IGBT Modules — 650V to 1700V for Power Electronics Systems

    SHYSEMI’s IGBT module models and functional configurations are designed to be compatible with leading platforms from industry-recognized brands such as Infineon, Fuji Electric, and Silan Microelectronics.
    All IGBT chips are developed in-house, ensuring consistent quality and long-term supply stability. Within the 62 mm and Econo package families, key performance parameters demonstrate advantages over comparable Japanese products and are positioned among the top-tier offerings in the domestic market.

  • SHYSEMI's IGBT Module Classification

    SHYSEMI’s IGBT modules address a broad range of application requirements, with current ratings spanning from 8 A to 800 A. Based on market demand, the product portfolio is categorized into three series: the Mid/High Power F Series, Mid Power E Series, and Low Power N Series, providing flexible selection across a wide current range.

  • The Advantages of Each Series

    SHYSEMI quickly established its brand image in China by leveraging its product advantages and forging deep partnerships with numerous reputable products.

    F Series: Silver-Plated Pins, High Power Density, Harsh Environment Ready

    Voltage: 1200V/1700V

    Current range: 40A-800A

    • Silver plated pins for easier soldering
    • Including heat dissipation substrate, providing higher power density
    • Including low thermal resistance aluminum oxide insulation substrate
    • Low switching and conduction losses
    • Saturation pressure drop positive temperature coefficient
    • High creepage and clearance distance
    • Suitable for harsh environments
    • Ability to adapt to high-temperature cycling
    • Industry standard package

    E Series: 17mm Compact Design, Integrated NTC, Nickel-Plated Substrate

    Voltage: 1200V

    Current range: 25A-600A

    Silver plated pins for easier soldering ●

    Nickel plating on the substrate to prevent oxidation and make it easier to store ●

    Including low thermal resistance aluminum oxide insulation substrate ●

    Low switching and conduction losses ●

    Saturation pressure drop positive temperature coefficient ●

    Integrated thermal protection NTC and low module height ●

    17mm in size, suitable for compact design and applications ●

    Industry standard package ●

    N Series: Crimping Technology, Ultra-Compact for Cost-Sensitive Designs

    Voltage: 1200V

    Current range: 8A-50A

    • Silver plated pins for easier soldering and longer storage time
    • Nickel plating on the substrate to prevent
    • Including low thermal resistance aluminum oxide insulation substrate
    • Low switching and conduction losses
    • Saturation pressure drop positive temperature coefficient
    • Optional crimping technology pins
    • Compact design
    • Integrated temperature protection thermistor
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